-40%
M.2 NGFF 2280 PCI-E NVME SSD Copper Heatsink Thermal Conductive Adhesive 67*18*2
$ 1.57
- Description
- Size Guide
Description
M.2 NGFF 2280 PCI-E NVME SSD Copper Heatsink Thermal Conductive Adhesive 67*18*2Features:
The ultra thin heatsink is designed for the notebook and some small space heat dissipation.
Pure copper (401W/mk) has higher thermal conductivity than pure aluminum (237W/mk).
Heat exchanger can exude heat faster by heat exchange through contact with air.
Support the M.2 NGFF 2280 SSD.
Material: Pure Copper
Color: Shown as pictures
Size: 67Ă—18mm
Thickness: 2mm
Quantity: 1
piece
Package includes:
1 X Heatsink
1 X Thermal Conductive Adhesive